We’re less than a month away from Odyssey Expo 2019, which is the only event this year that is focused on diecutting, diemaking, printing and packaging enhancements, which includes foil, embossing, and UV coatings. From May 1-3, more than 1,600 attendees will join together for Odyssey Expo, which is happening this year in Atlanta.
Attending this event will give you the opportunity to interact with a wide range of converters and suppliers, so you can truly understand the technological advancements in packaging and open up new opportunities to your customers. You’ll also get the latest update on Heidelberg’s complete line of folder gluers, diecutters, hot foil stampers, double platen hot foiling diecutters (for inline foiling, cutting/creasing, stripping, blanking) and blank inspection machines, while also speaking with our experts on the latest know-how for advanced applications.
We’ll be there, and we’re hoping to see you there too! If you’re planning on going to Odyssey Expo, kick off the event with us at Suntrust Park on April 30th to watch the Atlanta Braves take on the San Diego Padres!
For more information, fill out the form below and a Heidelberg Representative will be in contact with you shortly: